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Prof. Dr.-Ing. Christian Boit

Lupe

Head of the department of Semiconductor Devices
since July 2002


Contact
Phone: +49 30 314-25520
Fax: +49 30 314-29761
Room: E 103
E-Mail: christian.boit[AT]tu-berlin.de

Google scholar profile (Link)

Biography

  • Prof. Dr. Christian Boit is head of the semiconductor device department, an institution for research and development of equipment and software application in the areas device simulation, technology, characterization, reliability and focus on failure analysis, offering also training and commercial analytical service on backside techniques.
  • He received the diploma in physics and the PhD in electrical engineering on power devices from the Berlin University of Technology.
  • In 1986 he joined Siemens AG's Research laboratories for semiconductor electronics in Munich and has been pioneer on photoemission, 1990 he participated in the joint IBM-Siemens 64M DRAM development team in East Fishkill NY (USA).
  • He returned 1993 to the Siemens semiconductor group as failure analysis manager, has pushed many projects on leading edge techniques, and has been director of failure analysis in InfineonTechnologies AG, Munich until 2002, responsible for the Infineon analysis tasks, the F/A roadmap and coordination of all F/A groups in the company including best practise benchmark activities.
  • He has contributed to books, is author of several invited and altogether more than 50 publications and contributions to international conferences on various topics of technology and electrical/physical analysis of semiconductors, with Photoemission as a center of gravity. On this topic he received 1993 the VDE-Award in Frankfurt/M. and is a lecturer on ISTFA's Workshop.
  • He is member at large of the EDFAS board of directors and chairman of the EDFAS Publication Committee.
  • He was part in the Organization Committee of the conference ISTFA, the world's premier event in Electronic Device Failure Analysis, 2002 as General Chair.
  • He is member of VDE (German Society of Electrical Engineering) and head of their department 8.5, Quality and Reliability of Microelectronics, founding member of the board of the European Failure Analysis Network EUFANET and has contributed to the Microelectronics Failure Analysis broadcast course of the University New Mexico, Albuquerque.
  • Prof. Boit is member of the Editorial Board of Future Fab International and the Business Briefings.

Publications

O. Gref and J. Sandström and M. Weizman and M. Rhein and S. Gall and R. Schlatmann and C. Boit and F. Friedrich (2014). Investigation of Laser-fired Rear-side Point Contacts of Laser-crystallized Silicon Thin-film Solar Cells by Conductive Probe Atomic Force Microscopy. Energy Procedia, 76-80.


C. Helfmeier and R. Schlangen and C. Boit (2014). Focused ion beam contact to nonvolatile memory cells. Microelectronics Reliability, 1798-1801.


C. Herzog and O. Bakaeva and C. Boit and B. Kanngießer and F. Friedrich (2014). Study on non-destructive identification of gallium concentration gradients in Cu(In, Ga)Se2 solar cells and their efficiency impact. Applied Physics Letters, 43904.


P. Scholz and N. Herfurth and M. Sadowski and T. Lundquist and U. Kerst and C. Boit (2014). Efficient and flexible Focused Ion Beam micromachining of Solid Immersion Lenses in various bulk semiconductor materials - an adaptive calibration algorithm. Microelectronics Reliability, 1794-1797.


C. Helfmeier and D. Nedospasov and S. Tajik and C. Boit and J.-P. Seifert (2014). Physical Vulnerabilities of Physically Unclonable Functions. Design, Automation and Test in Europe Conference and Exhibition (DATE). IEEE, 1-4.


C. Boit and N. Schäfer and D. Abou-Ras and C. Helfmeier and A. Glowacki and U. Kerst (2014). Backside Failure Analysis Techniques: What's the Gain of Silicon Getting Thinner?. Proceedings of the 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2014). IEEE, 17-21.


S. Tajik and D. Nedospasov and C. Helfmeier and J.-P. Seifert and C. Boit (2014). Emission Analysis of Hardware Implementations. Proceedings of 17th EUROMICRO DSD, Verona (I), August 27-29, 2014. IEEE press, 528-534.


A. Teodoreanu and R. Leihkauf and C. Boit and F. Friedrich and L. Korte (2014). On the Origin of the Peak-and-Through Signal in the Grain-Boundary Light-Beam-Induced-Current Characterization Technique - 2D Numerical Simulations. Proc. of 29th European Photovoltaic Solar Energy Conference and Exhibition - EU PVSEC. WIP Munich, 25-30.


S. Tajik and E. Dietz and J.-P. Seifert and D. Nedospasov and S. Frohmann and C. Helfmeier and H. Dittrich and C. Boit (2014). Physical Characterization of Arbiter PUFs. Cryptographic Hardware and Embedded Systems – CHES 2014. Springer, 493-509.


A.-M. Teodoreanu and F. Friedrich and R. Leihkauf and C. Boit and C. Leendertz and L. Korte (2013). 2D Modelling of Polycrystalline Silicon Thin Film Solar Cells. EPJ Photovoltaics, 45104-p1-45104-p6.


P. Scholz and A. Glowacki and U. Kerst and C. Boit and P. Ivo and R. Lossy and H. Würfl and Y. Yokoyama (2013). Single image spectral electroluminescence (photon emission) of GaN HEMTs. Proceedings of the 51st International Reliability Physics Symposium (IRPS 2013). IEEE Press, CD.3.1-CD.3.7.


R. Di Giacomo and B. Maresca and M. Angelillo and G. Landi and A. Leone and M. Vaccaro and C. Boit and A. Porta and H. Neitzert (2013). Bio-Nano-Composite Materials Constructed With Single Cells and Carbon Nanotubes: Mechanical, Electrical, and Optical Properties. IEEE Transactions on Nanotechnology, 1026-1030.


C. Boit and C. Helfmeier and U. Kerst (2013). Security Risks Posed By Modern IC Debug & Diagnosis Tools. Int. Workshop on Fault Diagnosis and Tolerance in Cryptography - FDTC 2013


C. Boit and C. Helfmeier and D. Nedospasos and A. Fox (2013). Ultra High Precision Circuit Diagnosis Through Seebeck Generation and Charge Monitoring. Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2013)


C. Boit and C. Helfmeier and D. Nedospasov (2013). Feasibly Clonable Functions. Int. Workshop on Trustworthy Embedded Devices (TrustED '13)


C. Helfmeier and C. Boit and D. Nedospasov and J. Krissler and J. Seifert and C. Tarnovsky (2013). Breaking and Entering through the Silicon. CCS' 2013, November 4-8, 2013, Berlin, Germany


D. Nedospasov and C. Helfmeier and J. Seifert and C. Boit (2013). Invasive PUF Analysis. Int. Conference on Fault Diagnosis and Tolerance in Cryptography 2013 (FDTC 2013)


O. Bakaeva and F. Friedrich and R. Leihkauf and A. Teodoreanu and M. Boostandoost and T. Unold and C. Boit (2013). Study of minority carrier lifetime and absorber doping influence on the performance of chalcogenide solar cells with graded band gap. Proceedings of 28th EU PVSEC. WIP Munich, 2370-2375.


F. Friedrich and K. Mack and N. Krishnan and S. Kühnapfel and B. Stannowski and C. Schultz and R. Schlatmann and C. Boit (2013). Practical considerations in quantitative dark and illuminated lock-in thermography analyses of shunts in silicon thin-film modules. Proceedings of 28th EU PVSEC. WIP Munich, 2537-2541.


C. Helfmeier and C. Boit and D. Nedospasov and J. -P. Seifert (2013). Cloning Physically Unclonable Functions. Proceedings of International Symposium on Hardware-Oriented Security and Trust (HOST) 2012. IEEE press, 1-6.


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Address

Technische Universität Berlin
Department of Semiconductor Devices
sec. E4
Einsteinufer 19
10587 Berlin