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Prof. Dr.-Ing. Christian Boit

Lupe

Head of the department of Semiconductor Devices
since July 2002


Contact
Phone: +49 30 314-25520
Fax: +49 30 314-29761
Room: E 103
E-Mail: christian.boit[AT]tu-berlin.de

Google scholar profile (Link)

Biography

  • Prof. Dr. Christian Boit is head of the semiconductor device department, an institution for research and development of equipment and software application in the areas device simulation, technology, characterization, reliability and focus on failure analysis, offering also training and commercial analytical service on backside techniques.
  • He received the diploma in physics and the PhD in electrical engineering on power devices from the Berlin University of Technology.
  • In 1986 he joined Siemens AG's Research laboratories for semiconductor electronics in Munich and has been pioneer on photoemission, 1990 he participated in the joint IBM-Siemens 64M DRAM development team in East Fishkill NY (USA).
  • He returned 1993 to the Siemens semiconductor group as failure analysis manager, has pushed many projects on leading edge techniques, and has been director of failure analysis in InfineonTechnologies AG, Munich until 2002, responsible for the Infineon analysis tasks, the F/A roadmap and coordination of all F/A groups in the company including best practise benchmark activities.
  • He has contributed to books, is author of several invited and altogether more than 50 publications and contributions to international conferences on various topics of technology and electrical/physical analysis of semiconductors, with Photoemission as a center of gravity. On this topic he received 1993 the VDE-Award in Frankfurt/M. and is a lecturer on ISTFA's Workshop.
  • He is member at large of the EDFAS board of directors and chairman of the EDFAS Publication Committee.
  • He was part in the Organization Committee of the conference ISTFA, the world's premier event in Electronic Device Failure Analysis, 2002 as General Chair.
  • He is member of VDE (German Society of Electrical Engineering) and head of their department 8.5, Quality and Reliability of Microelectronics, founding member of the board of the European Failure Analysis Network EUFANET and has contributed to the Microelectronics Failure Analysis broadcast course of the University New Mexico, Albuquerque.
  • Prof. Boit is member of the Editorial Board of Future Fab International and the Business Briefings.

Publications

C. Pagano and C. Boit and Y. Yokoyama (2011). Detecting Laser Beam Reflectance Modulated by Electronic Device Operation with a Simple Setup. Proceedings of the 49th International Reliability Physics Symposium (IRPS 2011). IEEE print, 774-779.


P. Scholz and U. Kerst and T. Kujawa and T. Lundquist and C. Boit (2011). Instant Solid Immersion Lens creation in silicon with a Focused Ion Beam - comparing refractive and diffractive methods. Proceedings of the 37th International Symposium for Testing and Failure Analysis (ISTFA 2011). ASM International, 46-53.


F. Beaudoin and R. Desplats and P. Perdu and C. Boit (2011). Principles of Thermal Laser Stimulation Techniques. Microelectronics Failure Analysis - Desk Reference Sixth Edition. ASM International, 340-348.


C. Boit (2011). Fundamentals of Photon Emission (PEM) in Silicon - Electroluminescence for Analysis of Electronic Circuit and Device Functionality. Microelectronics Failure Analysis - Desk Reference Sixth Edition. ASM International, 279-291.


C. Boit and K. Scholtens and R. Weiland and S. Görlich and D. Schlenker (2011). Managing the Unpredictable - A Busines Model for Failure Analysis Service. Microelectronics Failure Analysis - Desk Reference Sixth Edition. ASM International, 627-634.


M. Boostandoost and U. Kerst and C. Boit (2010). Extraction of local thin-film solar cell parameters by bias-dependent IR-LBIC. Microelectronics Reliability, 1899-1902.


P. Scholz and C. Gallrapp and U. Kerst and T. Lundquist and C. Boit (2010). Optimizing focused ion beam created solid immersion lenses in bulk silicon using design of experiments. Microelectronics Reliability, 1523-1528.


C. Boit and V. Dallakyan and V. Gomtsyan and T. Karapetyan and U. Kerst and V. Rashoyan and R. Vardanyan (2010). Experimental investigation of laser beam transmission and focusing inside of mediums. Proceedings of Engineering Academy of Armenia. Elsevier, 332-337.


C. Boit and V. Dallakyan and U. Kerst and R. Vardanyan (2010). Computer-aided analysis of laser beam transmission and focusing inside of materials. Proceedings of Engineering Academy of Armenia. Elsevier, 531-535.


M. Boostandoost and U. Kerst and C. Boit (2010). Microscopic characterization of thin-film crystalline silicon solar cells by electroluminescence and infrared LBIC. Proceedings of the 25th European Photovoltaic Solar Energy Conference and Exhibition / 5th World Conference on Photovoltaic Energy Conversion. WIP - Renewable Energies, 3556-3556.


M. Boostandoost and U. Kerst and C. Boit (2010). Activation Energy Analysis of Dark and Laser Illuminated I-V Characteristics of Thin-Film Poly Silicon Solar Cells. Proceedings of the 36th International Symposium for Testing and Failure Analysis (ISTFA 2010). ASM International, 158-162.


T. Breuer and U. Kerst and C. Boit and E. Langer and H. Ruelke (2010). Ultra-Low-k Porous SiCOH Dielectric Degradation Process before Breakdown. Proceedings of the 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010). IEEE Press, 91-96.


T. Breuer and U. Kerst and C. Boit and E. Langer and H. Ruelke (2010). Ultra-Low-k Dielectric Degradation before Breakdown. Proceedings of the 48th International Reliability Physics Symposium (IRPS 2010). IEEE Society, 890-894.


A. Glowacki and C. Helfmeier and U. Kerst and C. Boit (2010). Improvement of optical resolution through chip backside using FIB trenches. Proceedings of the 36th International Symposium for Testing and Failure Analysis (ISTFA 2010). ASM International, 176-180.


T. Kiyan and C. Brillert and C. Boit (2010). Timing Characterization of a Tester Operated Integrated Circuit by Continuous and Pulsed Laser Stimulation. Proceedings of the 36th International Symposium for Testing and Failure Analysis (ISTFA 2010). ASM International, 211-216.


P. Scholz and U. Kerst and T. Kujawa and T. Lundquist and C. Boit (2010). Developing a Chemistry-Assisted Focused Ion Beam Process for 'On-Demand' Solid Immersion Lenses in Silicon. Proceedings of the 36th International Symposium for Testing and Failure Analysis (ISTFA 2010). ASM International, 389-392.


A. Glowacki and P. Laskowski and C. Boit and P. Ivo and E. Bahat-Treidel and R. Pazirandeh and R. Lossy and J. Würfl and G. Tränkle (2009). Characterization of stress degradation effects and thermal properties of AlGaN/GaN HEMTS with photon emission spectral signatures. Microelectronics Reliability, 1211-1215.


R. Schlangen and R. Leihkauf and U. Kerst and T. Lundquist and P. Egger and C. Boit (2009). Physical analysis, trimming and editing of nanoscale IC function with backside FIB processing. Microelectronics Reliability, 1158-1164.


M. Boostandoost and H. Lin and U. Kerst and C. Boit (2009). Analysis of poly-Si thin film solar cells by IR-LBIC. Proceedings of the 35th International Symposium for Testing and Failure Analysis (ISTFA 2009). ASM International, 157-161.


P. Ivo and A. Glowacki and E. Bahat-Treidel and R. Pazirandeh and R. Lossy and J. Würfl and G. Tränkle and C. Boit (2009). Influence of GaN cap on robustness of AlGaN/GaN HEMTs. Proceedings of the 47th International Reliability Physics Symposium (IRPS 2009). IEEE Press, 71-75.


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Technische Universität Berlin
Department of Semiconductor Devices
sec. E4
Einsteinufer 19
10587 Berlin