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Prof. Dr.-Ing. Christian Boit

Lupe

Head of the department of Semiconductor Devices
since July 2002


Contact
Phone: +49 30 314-25520
Fax: +49 30 314-29761
Room: E 103
E-Mail: christian.boit[AT]tu-berlin.de

Google scholar profile (Link)

Biography

  • Prof. Dr. Christian Boit is head of the semiconductor device department, an institution for research and development of equipment and software application in the areas device simulation, technology, characterization, reliability and focus on failure analysis, offering also training and commercial analytical service on backside techniques.
  • He received the diploma in physics and the PhD in electrical engineering on power devices from the Berlin University of Technology.
  • In 1986 he joined Siemens AG's Research laboratories for semiconductor electronics in Munich and has been pioneer on photoemission, 1990 he participated in the joint IBM-Siemens 64M DRAM development team in East Fishkill NY (USA).
  • He returned 1993 to the Siemens semiconductor group as failure analysis manager, has pushed many projects on leading edge techniques, and has been director of failure analysis in InfineonTechnologies AG, Munich until 2002, responsible for the Infineon analysis tasks, the F/A roadmap and coordination of all F/A groups in the company including best practise benchmark activities.
  • He has contributed to books, is author of several invited and altogether more than 50 publications and contributions to international conferences on various topics of technology and electrical/physical analysis of semiconductors, with Photoemission as a center of gravity. On this topic he received 1993 the VDE-Award in Frankfurt/M. and is a lecturer on ISTFA's Workshop.
  • He is member at large of the EDFAS board of directors and chairman of the EDFAS Publication Committee.
  • He was part in the Organization Committee of the conference ISTFA, the world's premier event in Electronic Device Failure Analysis, 2002 as General Chair.
  • He is member of VDE (German Society of Electrical Engineering) and head of their department 8.5, Quality and Reliability of Microelectronics, founding member of the board of the European Failure Analysis Network EUFANET and has contributed to the Microelectronics Failure Analysis broadcast course of the University New Mexico, Albuquerque.
  • Prof. Boit is member of the Editorial Board of Future Fab International and the Business Briefings.

Publications

R. Schlangen and R. Leihkauf and T. Lundquist and P. Egger and C. Boit (2009). RF Performance Increase Allowing IC Timing Adjustments by Use of Backside FIB Processing. Proceedings of the 16th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2009). IEEE Press, 33-36.


R. Schlangen and R. Leikauf and U. Kerst and P. Egger and T. Lundquist and C. Boit (2009). Extended Circuit Edit, Analysis and Trimming Capabilities based on the Backside Focused Ion Beam created Ultra Thin Silicon Platform. Proceedings of the 35th International Symposium for Testing and Failure Analysis (ISTFA 2009). ASM International, 21-26.


P. Scholz and U. Kerst and C. Tsao and T. Lundquist and C. Boit (2009). A Versatile Design of Solid Immersion Lenses in Bulk Silicon Using Focused Ion Beam Techniques. Proceedings of the 35th International Symposium for Testing and Failure Analysis (ISTFA 2009). ASM International, 119-125.


C. Boit and R. Schlangen and A. Glowacki and U. Kindereit and T. Kiyan and U. Kerst and T. Lundquist and S. Kasapi and H. Suzuki (2008). Physical IC Debug - Backside Approach and Nanoscale Challenge. Advances in Radio Science, 265-272.


C. Boit and R. Schlangen and U. Kerst and T. Lundquist (2008). Physical Techniques for Chip-Backside IC Debug in Nanotechnologies. IEEE Design & Test of Computers - Special Issue on Silicon Debug and Diagnosis, 250-257.



P. Laskowski and A. Glowacki and C. Boit (2008). Detectability of dynamic photon emission in static Si CCD for signal path determination in integrated circuits. Microelectronics Reliability, 1295-1299.


C. Boit (2008). Scale, Function and Materials: Debug and Diagnosis in electronic Device Technology Roadmap. Proceedings of the 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2008). IEEE Press, 9-14.


C. Boit (2008). Tutorial 6: FIB and Silicon Debug & Diagnosis of ICs in Submicron Technologies. Tutorial notes of the 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2008). IEEE Press.


A. Glowacki and C. Boit and R. Lossy and J. Würfl (2008). Photon Emission Spectral Signatures of AIGaN/GaN HEMT for Functional and Reliability Analysis. Proceedings of the 34th International Symposium for Testing and Failure Analysis (ISTFA 2008). ASM International, 220.


T. Kiyan and C. Boit and C. Brillert (2008). Timing Sensitivity Analysis of Logical Nodes in Scan Design Integrated Circuits by Pulsed Diode Laser Stimulation. Proceedings of the 34th International Symposium for Testing and Failure Analysis (ISTFA 2008). ASM International, 180.


E. O'Donnell and D. Scott and T. Malik and R. Jain and T. Lundquist and R. Schlangen and U. Kerst and C. Boit (2008). Advanced Methodologies for Backside Circuit Edit. Proceedings of the 34th International Symposium for Testing and Failure Analysis (ISTFA 2008). ASM International, 305.


R. Schlangen and R. Leihkauf and T. Lundqist and P. Egger and U. Kerst and C. Boit (2008). Trimming of IC Timing and Delay by Backside FIB Processing - Comparison of Conventional and Strained Technologies. iedm TECHNICAL DIGEST of IEEE international Electron Devices meeting 2008. IEEE Press, 439-442.


P. Scholz and U. Kerst and C. Boit and C. Tsao and T. Lundquist (2008). Creation of Solid Immersion Lenses in Bulk Silicon Using Focused Ion Beam Backside Editing Techniques. Proceedings of the 34th International Symposium for Testing and Failure Analysis (ISTFA 2008). ASM International, 157.


A. Glowacki and S. Brahma and H. Suzuki and C. Boit (2007). Systematic Characterization of Integrated Circuit Standard Components as Stimulated by Scanning Laser Beam. IEEE Transactions on Device and Materials Reliability, 31-49.


U. Kindereit and G. Woods and J. Tian and U. Kerst and R. Leihkauf and C. Boit (2007). Quantitative Investigation of Laser Beam Modulation in Electrically Active Devices as Used in Laser Voltage Probing. IEEE Transactions on Device and Materials Reliability, 19-30.


R. Schlangen and U. Kerst and C. Boit and T. Malik and R. Jain and T. Lundquist (2007). Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy. Microelectronics Reliability, 1523-1528.


A. Glowacki and S. Brahma and C. Boit and H. Suzuki (2007). Thermal Laser Stimulation of Active and Passive Devices in Integrated Circuits. Official Proceedings of the International Conference "Thermal Problems in Electronic". sowadruk.pl, 29-43.


R. Jain and T. Malik and T. Lundquist and Q. Wang and R. Schlangen and U. Kerst and C. Boit (2007). Effects of Backside Circuit Edit on Transistor Characteristics. Proceedings of the 33rd International Symposium for Testing and Failure Analysis (ISTFA 2007). ASM International, 29-33.


R. Jain and T. Malik and T. Lundquist and R. Schlangen and R. Leihkauf and U. Kerst and C. Boit (2007). Novel Flip-Chip Probing Methodology Using Electron Beam Probing. Proceedings on 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2007 (IPFA 2007). IEEE Press, 39-43.


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Technische Universität Berlin
Department of Semiconductor Devices
sec. E4
Einsteinufer 19
10587 Berlin