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Prof. Dr.-Ing. Christian Boit

Lupe

Head of the department of Semiconductor Devices
since July 2002


Contact
Phone: +49 30 314-25520
Fax: +49 30 314-29761
Room: E 103
E-Mail: christian.boit[AT]tu-berlin.de

Google scholar profile (Link)

Biography

  • Prof. Dr. Christian Boit is head of the semiconductor device department, an institution for research and development of equipment and software application in the areas device simulation, technology, characterization, reliability and focus on failure analysis, offering also training and commercial analytical service on backside techniques.
  • He received the diploma in physics and the PhD in electrical engineering on power devices from the Berlin University of Technology.
  • In 1986 he joined Siemens AG's Research laboratories for semiconductor electronics in Munich and has been pioneer on photoemission, 1990 he participated in the joint IBM-Siemens 64M DRAM development team in East Fishkill NY (USA).
  • He returned 1993 to the Siemens semiconductor group as failure analysis manager, has pushed many projects on leading edge techniques, and has been director of failure analysis in InfineonTechnologies AG, Munich until 2002, responsible for the Infineon analysis tasks, the F/A roadmap and coordination of all F/A groups in the company including best practise benchmark activities.
  • He has contributed to books, is author of several invited and altogether more than 50 publications and contributions to international conferences on various topics of technology and electrical/physical analysis of semiconductors, with Photoemission as a center of gravity. On this topic he received 1993 the VDE-Award in Frankfurt/M. and is a lecturer on ISTFA's Workshop.
  • He is member at large of the EDFAS board of directors and chairman of the EDFAS Publication Committee.
  • He was part in the Organization Committee of the conference ISTFA, the world's premier event in Electronic Device Failure Analysis, 2002 as General Chair.
  • He is member of VDE (German Society of Electrical Engineering) and head of their department 8.5, Quality and Reliability of Microelectronics, founding member of the board of the European Failure Analysis Network EUFANET and has contributed to the Microelectronics Failure Analysis broadcast course of the University New Mexico, Albuquerque.
  • Prof. Boit is member of the Editorial Board of Future Fab International and the Business Briefings.

Publications

U. Kindereit and G. Woods and J. Tian and U. Kerst and C. Boit (2007). Investigation of Laser Voltage Probing Signals in CMOS Transistors. Proceedings of the 45th International Reliability Physics Symposium (IRPS 2007). IEEE Soc., 526-533.


P. Laskowski and A. Glowacki and C. Boit and V. Gottschalk and H. Suzuki (2007). Application of Lock-in Phase Sensitive Detection to Thermal Laser Stimulation of ICs. Official Proceedings of the International Conference "Thermal Problems in Electronics". sowadruk.pl, 173-182.


R. Schlangen and R. Leihkauf and C. Boit and B. Kruger (2007). Functional IC Analysis Through Chip Backside With Nano Scale Resolution - E-Beam Probing in FIB Trenches to STI Level. Proceedings of the 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2007). IEEE Press, 35-38.


R. Schlangen and U. Kerst and C. Boit and S. Schömann and B. Krüger and R. Jain and T. Malik and T. Lundquist (2007). FIB backside circuit modification at the device level, allowing access to every circuit node with minimum impact on device performance by use of Atomic Force Probing. Proceedings of the 33rd International Symposium for Testing and Failure Analysis (ISTFA 2007). ASM International, 34-40.


R. Schlangen and R. Leihkauf and U. Kerst and C. Boit and R. Jain and T. Malik and K. Wilsher and T. Lundquist and B. Krüger (2007). Backside E-Beam Probing on Nano Scale Devices. Proceedings of the International Test Conference (ITC 2007). IEEE, 1-9.


R. Schlangen and P. Sadewater and U. Kerst and C. Boit (2006). Contact to Contacts or Silicide by use of Backside FIB Circuit Edit allowing to approach every Active Circuit Node. Microelectronics Reliability, 1489-1503.


S. Brahma and J. Heinig and A. Glowacki and R. Leikauf and C. Boit (2006). Distinction of Photo-Electric and Thermal Effects in a MOSFET by 1064 nm Laser Stimulation. Proceedings of the 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2006). IEEE Press, 333-339.


R. Schlangen and R. Leihkauf and U. Kerst and C. Boit (2006). Functional IC Analysis Through Chip Backside With Nano Scale Resolution - E-Beam Probing in FIB Trenches to STI Level. Proceedings of the 32nd International Symposium for Testing and Failure Analysis (ISTFA 2006). ASM International, 376-381.



S. Brahma and C. Boit and A. Glowacki (2005). Seebeck effect detection on biased device without OBIRCH distortion using FET readout. Microelectronics Reliability, 1487-1492.


R. Schlangen and U. Kerst and A. Kabakow and C. Boit (2005). Performance Evaluation of FIB Edited Circuits through Chip Backside Exposing Shallow Trench Isolations. Microelectronics Reliability, 1544-1549.


C. Boit and R. Schlangen and A. Kabakow and U. Kerst (2005). Impact of Backside Circuit Edit on Active Device Performance in Bulk Silicon ICs. Computer Society, 48.2/1-9.


C. Boit and U. Kerst and P. Sadewater and R. Schlangen (2005). Contacting Diffusion with FIB for Backside Circuit Edit - Procedures and Material Analysis. Proceedings of the 31st International Symposium for Testing and Failure Analysis (ISTFA 2005). ASM International, 64-69.


C. Boit and A. Glowacki (2005). Characterization of Thermoelectric Devices in ICs as Stimulated by a Scanning Laser Beam. Proceedings of the 43th International Reliability Physics Symposium (IRPS 2005), 450-457.


S. Brahma and C. Boit and A. Glowacki (2004). Localization of FET device performance with thermal laser stimulation.. Microelectronics Reliability, 1699-1702.


C. Boit and U. Kerst and P. Sadewater and R. Leihkauf and S. Schönmann and E. Le Roy and T. Lundquist (2004). Contacting Silicon with FIB for Backside Circuit Edit. Proceedings of the 30th International Symposium for Testing and Failure Analysis (ISTFA 2004). ASM International, 157-161.


C. Boit and A. Glowacki and S. Brahma and K. Wirth (2004). Thermal laser stimulation of active devices in silicon-a quantitative FET parameter investigation. Proceedings of the 43th International Reliability Physics Symposium (IRPS 2004), 357-369.


S. Peters and R. Leihkauf and H.-G. Wagemann and C. Boit (2004). I(V)-characteristic of Si thin-film solar cells within a monolithically series-interconnected SOI module: measurement and simulation. 19th European Photovoltaic Solar Energy Conference, 690-693.


C. Boit and F. Beaudoin and R. Desplats and P. Perdu (2004). Principles of Thermal Laser Stimulation Techniques.. Microelectronics Failure Analysis - Desk Reference Fifth Edition. ASM International, 417-425.


C. Boit (2004). New Package Technologies as Trigger of a Paradigm Shift in Physical Techniques for IC Debug: Access Through Backside.. The World of Electronic Packaging and System Integration.. ddp goldenbogen, 408-414.


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Address

Technische Universität Berlin
Department of Semiconductor Devices
sec. E4
Einsteinufer 19
10587 Berlin