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A

Electron-beam-induced current measurements with applied bias provide insight to locally resolved acceptor concentrations at p-n junctions

D. Abou-Ras and N. Schäfer and N. Baldaz and S. Brunken and C. Boit

AIP Advances, 077191-1-7. 2015

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Analysis of Cu(In,Ga)(S,Se)2 thin-film solar cells by means of electron microscopy

D. Abou-Ras and J. Dietrich and J. Kavalakkatt and M. Nichterwitz and S. Schmidt and C. Koch and R. Cabballero and J. Klaer and T. Rissom

Solar Energy Materials & Solar Cells, 1452-1462. 2010

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Modeling Infrastructure Along the Value Chain: from Materials to System Performance

Y. Augarten and W. Sprenger and B. Pieters and R. Varache and O. Bakaeva and G. Janssen and Y. Guanchao and F. Friedrich and M. Schmid and M. Celino and J. Hüpkes

Proc. of 28th European Photovoltaic Solar Energy Conference and Exhibition - EU PVSEC. WIP Munich, 3949-3952. 2013

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B

Study of minority carrier lifetime and absorber doping influence on the performance of chalcogenide solar cells with graded band gap

O. Bakaeva and F. Friedrich and R. Leihkauf and A. Teodoreanu and M. Boostandoost and T. Unold and C. Boit

Proceedings of 28th EU PVSEC. WIP Munich, 2370-2375. 2013

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Principles of Thermal Laser Stimulation Techniques

F. Beaudoin and R. Desplats and P. Perdu and C. Boit

Microelectronics Failure Analysis - Desk Reference Sixth Edition. ASM International, 340-348. 2011

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Sicherheitsrisiken durch IC-Debugger und Diagnose-Tools

C. Boit

25, SMARTCARD-Workshop Darmstadt 4. und 5. Feb. 2015. Fraunhofer Verlag, 30-35. 2015

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FA Tools and IC Security

C. Boit and P. Scholz

Electronic Device Failure Analysis, 2,49. 2016

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From IC Debug to Hardware Security Risk: The Power of Backside Access and Optical Interaction

C. Boit and S. Tajik and P. Scholz and E. Amini and A. Beyreuther and H. Lohrke and J.-P. Seifert

Proceedings of the 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2016). IEEE, 365-369. 2016

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Photon Emission: A Technique Supposed to Fade Is Dying Really Hard

C. Boit

Electronic Device Failure Analysis, 46-47. 2012

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Testing and failure analysis of thin film solar cells

C. Boit and M. Boostandoost and F. Friedrich and A. Glowacki

Phys. Status Solidi C, 3005-3008. 2011

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Physical IC Debug - Backside Approach and Nanoscale Challenge

C. Boit and R. Schlangen and A. Glowacki and U. Kindereit and T. Kiyan and U. Kerst and T. Lundquist and S. Kasapi and H. Suzuki

Advances in Radio Science, 265-272. 2008

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Physical Techniques for Chip-Backside IC Debug in Nanotechnologies

C. Boit and R. Schlangen and U. Kerst and T. Lundquist

IEEE Design & Test of Computers - Special Issue on Silicon Debug and Diagnosis, 250-257. 2008

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New physical techniques for IC functional analysis of on-chip devices and interconnects

C. Boit

Applied Surface Science, 18-23. 2005

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Design, Metrics, and control of the Unpredictable : A Business Model for Failure Analysis Service (Part 1)

C. Boit and K. Scholtens and R. Weiland and S. Görlich and C. Brillert and C. Burner and P. Egger and D. Schlenker

Electronic Device Failure Analysis, 15-21. 2003

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Design, Metrics, and control of the Unpredictable : A Business Model for Failure Analysis Service (Part 2)

C. Boit and K. Scholtens and R. Weiland and S. Görlich and C. Brillert and C. Burner and P. Egger and D. Schlenker

Electronic Device Failure Analysis, 17-22. 2003

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Quantitative Aspects of Optical IC Debug Using State-of-the Art Backside Preparation

C. Boit and A. Glowacki and C. Pagano and U. Kerst and Y. Yokoyama

Proc. IEEE IPFA 2012. ASM int., 1-6. 2012

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Experimental investigation of laser beam transmission and focusing inside of mediums

C. Boit and V. Dallakyan and V. Gomtsyan and T. Karapetyan and U. Kerst and V. Rashoyan and R. Vardanyan

Proceedings of Engineering Academy of Armenia. Elsevier, 332-337. 2010

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Computer-aided analysis of laser beam transmission and focusing inside of materials

C. Boit and V. Dallakyan and U. Kerst and R. Vardanyan

Proceedings of Engineering Academy of Armenia. Elsevier, 531-535. 2010

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Scale, Function and Materials: Debug and Diagnosis in electronic Device Technology Roadmap

C. Boit

Proceedings of the 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2008). IEEE Press, 9-14. 2008

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Tutorial 6: FIB and Silicon Debug & Diagnosis of ICs in Submicron Technologies

C. Boit

Tutorial notes of the 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2008). IEEE Press. 2008

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Contactless Visible Light Probing for Nanoscale ICs through 10 µm Bulk Silicon

C. Boit and H. Lohrke and P. Scholz and A. Beyreuther and U. Kerst and Y. Iwaki

Proceedings of the 35th Annual NANO Testing Symposium (NANOTS2015), 215-221. 2015

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Impact of Backside Circuit Edit on Active Device Performance in Bulk Silicon ICs

C. Boit and R. Schlangen and A. Kabakow and U. Kerst

Computer Society, 48.2/1-9. 2005

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Contacting Diffusion with FIB for Backside Circuit Edit - Procedures and Material Analysis

C. Boit and U. Kerst and P. Sadewater and R. Schlangen

Proceedings of the 31st International Symposium for Testing and Failure Analysis (ISTFA 2005). ASM International, 64-69. 2005

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Characterization of Thermoelectric Devices in ICs as Stimulated by a Scanning Laser Beam

C. Boit and A. Glowacki

Proceedings of the 43th International Reliability Physics Symposium (IRPS 2005), 450-457. 2005

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Contacting Silicon with FIB for Backside Circuit Edit

C. Boit and U. Kerst and P. Sadewater and R. Leihkauf and S. Schönmann and E. Le Roy and T. Lundquist

Proceedings of the 30th International Symposium for Testing and Failure Analysis (ISTFA 2004). ASM International, 157-161. 2004

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Backside Failure Analysis Techniques: What's the Gain of Silicon Getting Thinner?

C. Boit and N. Schäfer and D. Abou-Ras and C. Helfmeier and A. Glowacki and U. Kerst

Proceedings of the 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2014). IEEE, 17-21. 2014

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Thermal laser stimulation of active devices in silicon-a quantitative FET parameter investigation

C. Boit and A. Glowacki and S. Brahma and K. Wirth

Proceedings of the 43th International Reliability Physics Symposium (IRPS 2004), 357-369. 2004

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Security Risks Posed By Modern IC Debug & Diagnosis Tools

C. Boit and C. Helfmeier and U. Kerst

Int. Workshop on Fault Diagnosis and Tolerance in Cryptography - FDTC 2013 2013

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Voltage Contrast Like Imaging of N-Wells

C. Boit and K. Wirth and E. Le Roy

Proceedings of the 29th International Symposium for Testing and Failure Analysis (ISTFA 2003). ASM International, 7-7. 2003

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Ultra High Precision Circuit Diagnosis Through Seebeck Generation and Charge Monitoring

C. Boit and C. Helfmeier and D. Nedospasos and A. Fox

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2013) 2013

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Feasibly Clonable Functions

C. Boit and C. Helfmeier and D. Nedospasov

Int. Workshop on Trustworthy Embedded Devices (TrustED '13) 2013

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Fundamentals of Photon Emission (PEM) in Silicon - Electroluminescence for Analysis of Electronic Circuit and Device Functionality

C. Boit

Microelectronics Failure Analysis - Desk Reference Sixth Edition. ASM International, 279-291. 2011

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Managing the Unpredictable - A Busines Model for Failure Analysis Service

C. Boit and K. Scholtens and R. Weiland and S. Görlich and D. Schlenker

Microelectronics Failure Analysis - Desk Reference Sixth Edition. ASM International, 627-634. 2011

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Principles of Thermal Laser Stimulation Techniques.

C. Boit and F. Beaudoin and R. Desplats and P. Perdu

Microelectronics Failure Analysis - Desk Reference Fifth Edition. ASM International, 417-425. 2004

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New Package Technologies as Trigger of a Paradigm Shift in Physical Techniques for IC Debug: Access Through Backside.

C. Boit

The World of Electronic Packaging and System Integration.. ddp goldenbogen, 408-414. 2004

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Managing the Unpredictable-A Business Model for Failure Analysis Service

C. Boit and K. Scholtens and R. Weiland and S. Görlich and D. Schlenker

Microelectronics Failure Analysis - Desk Reference Fifth Edition. ASM International, 722-729. 2004

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Fundamentals of Photon Emission (PEM) in Silicon - Electroluminescence for Analysis of Electronic Circuit and Device Functionality

C. Boit

Microelectronics Failure Analysis - Desk Reference Fifth Edition. ASM International, 356-368. 2004

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Characterization of poly-Si thin-film solar cell functions and parameters with IR optical interaction techniques

M. Boostandoost and F. Friedrich and U. Kerst and C. Boit and S. Gall and Y. Yokoyama

Journal of Materials Science: Materials in Electronics, 1553-1579. 2011

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Extraction of local thin-film solar cell parameters by bias-dependent IR-LBIC

M. Boostandoost and U. Kerst and C. Boit

Microelectronics Reliability, 1899-1902. 2010

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Challenges for parametric analysis of the solar cells using failure analysis technique developed for the microelectronics

M. Boostandoost and X. Ycaza and R. Leihkauf and U. Kerst and C. Boit

Conference Proceedings from the 38th Int. Symp. for Testing and Failure Analysis (ISTFA 2012). ASM International, 255-263. 2012

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Investigation of Enhanced Photocurrent at the Grain Boundary of Thin Film Polycrystalline Silicon Solar Cells by Infrared LBIC

M. Boostandoost and F. Friedrich and U. Kerst and U. Boit and S. Gall

26th European Photovoltaic Solar Energy Conference. WIP-Munich.de, 2791-2795. 2011

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Can illuminated IV-characteristics of micro-regions in solar cells be measured by laser-induced stimulation?

M. Boostandoost and A. Glowacki and O. Bakaeva and U. Kerst and C. Boit

Proceedings of the 37th International Symposium for Testing and Failure Analysis (ISTFA 2011). ASM International, 330-335. 2011

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Microscopic characterization of thin-film crystalline silicon solar cells by electroluminescence and infrared LBIC

M. Boostandoost and U. Kerst and C. Boit

Proceedings of the 25th European Photovoltaic Solar Energy Conference and Exhibition / 5th World Conference on Photovoltaic Energy Conversion. WIP - Renewable Energies, 3556-3556. 2010

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