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Prof. Dr.-Ing. Christian Boit

Lupe

Head of the department of Semiconductor Devices
since July 2002


Contact
Phone: +49 30 314-25520
Fax: +49 30 314-29761
Room: E 103
E-Mail: christian.boit[AT]tu-berlin.de

Google scholar profile (Link)

Biography

  • Prof. Dr. Christian Boit is head of the semiconductor device department, an institution for research and development of equipment and software application in the areas device simulation, technology, characterization, reliability and focus on failure analysis, offering also training and commercial analytical service on backside techniques.
  • He received the diploma in physics and the PhD in electrical engineering on power devices from the Berlin University of Technology.
  • In 1986 he joined Siemens AG's Research laboratories for semiconductor electronics in Munich and has been pioneer on photoemission, 1990 he participated in the joint IBM-Siemens 64M DRAM development team in East Fishkill NY (USA).
  • He returned 1993 to the Siemens semiconductor group as failure analysis manager, has pushed many projects on leading edge techniques, and has been director of failure analysis in InfineonTechnologies AG, Munich until 2002, responsible for the Infineon analysis tasks, the F/A roadmap and coordination of all F/A groups in the company including best practise benchmark activities.
  • He has contributed to books, is author of several invited and altogether more than 50 publications and contributions to international conferences on various topics of technology and electrical/physical analysis of semiconductors, with Photoemission as a center of gravity. On this topic he received 1993 the VDE-Award in Frankfurt/M. and is a lecturer on ISTFA's Workshop.
  • He is member at large of the EDFAS board of directors and chairman of the EDFAS Publication Committee.
  • He was part in the Organization Committee of the conference ISTFA, the world's premier event in Electronic Device Failure Analysis, 2002 as General Chair.
  • He is member of VDE (German Society of Electrical Engineering) and head of their department 8.5, Quality and Reliability of Microelectronics, founding member of the board of the European Failure Analysis Network EUFANET and has contributed to the Microelectronics Failure Analysis broadcast course of the University New Mexico, Albuquerque.
  • Prof. Boit is member of the Editorial Board of Future Fab International and the Business Briefings.

Publications

C. Boit and P. Scholz (2016). FA Tools and IC Security. Electronic Device Failure Analysis, 2,49.


O. Gref and A. Teodoreanu and R. Leihkauf and H. Lohrke and M. Kittler and D. Amkreutz and C. Boit and F. Friedrich (2016). Grain boundary light beam induced current: A characterization of bonded silicon wafers and polycrystalline silicon thin films for diffusion length extraction. Phys. Status Solidi, 1728-1737.


O. Gref and M. Weizman and H. Rhein and O. Gabriel and U. Gernert and R. Schlatmann and C. Boit and F. Friedrich (2016). Investigation of laser-fired point contacts on KOH structured laser-crystallized silicon by conductive atomic force microscopy. Applied Surface Science, 243-247.


C. Boit and S. Tajik and P. Scholz and E. Amini and A. Beyreuther and H. Lohrke and J.-P. Seifert (2016). From IC Debug to Hardware Security Risk: The Power of Backside Access and Optical Interaction. Proceedings of the 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2016). IEEE, 365-369.


H. Lohrke and P. Scholz and C. Boit and S. Tajik and J.-P. Seifert (2016). Automated Detection of Fault Sensitive Locations for Reconfiguration Attacks on Programmable Logic. Proceedings of the 42nd International Symposium for Testing and Failure Analysis (ISTFA 2016). ASM International, 348-353.


H. Lohrke and P. Scholz and A. Beyreuther and U. Ganesh and E. Uhlmann and S. Kühne and M. Jogodzinski and Y. Iwaki and R. Chivas and S. Silverman and C. Boit (2016). Contactless Fault Isolation for FinFET Technologies with Visible Light and GaP SIL. Proceedings of the 42nd International Symposium for Testing and Failure Analysis (ISTFA 2016). ASM International, 31-38.


H. Lohrke and S. Tajik and C. Boit and J. Seifert (2016). No Place to Hide: Contactless Probing of Secret Data on FPGAs. International Conference on Cryptographic Hardware and Embedded Systems - CHES 2016. Springer, 147-167.


C. Boit (2015). Sicherheitsrisiken durch IC-Debugger und Diagnose-Tools. 25, SMARTCARD-Workshop Darmstadt 4. und 5. Feb. 2015. Fraunhofer Verlag, 30-35.


S. Tajik and E. Dietz and S. Frohmann and H. Dittrich and D. Nedospasov and C. Helfmeier and J. -P. Seifert and C. Boit and H.-W. Hübers (2015). A Complete and Linear Physical Characterization Methodology for the Arbiter PUF Family. Proceedings of COSADE 2015. Springer, 1-2.


S. Tajik and H. Lohrke and F. Ganji and J. Seifert and C. Boit (2015). Laser Fault Attack on Physically Unclonable Functions. Proceedings of the 2015 Workshop on Fault Diagnosis and Tolerance in Cryptography (FDTC). IEEE computer society, 85-96.


D. Abou-Ras and N. Schäfer and N. Baldaz and S. Brunken and C. Boit (2015). Electron-beam-induced current measurements with applied bias provide insight to locally resolved acceptor concentrations at p-n junctions. AIP Advances, 077191-1-7.


O. Gref and M. Weizman and H. Rhein and O. Gabriel and U. Gernert and R. Schlatmann and C. Boit and F. Friedrich (2015). Investigation of laser-fired point contacts on KOH structured laser-crystallized silicon by conductive atomic force microscopy. Applied Surface Science, 1-2.


C. Helfmeier and A. Beyreuther and A. Fox and C. Boit (2015). Ultra sensitive measurement of dielectric current under pulsed stress conditions. Microelectronics Reliability, 2254-2257.


C. Boit and H. Lohrke and P. Scholz and A. Beyreuther and U. Kerst and Y. Iwaki (2015). Contactless Visible Light Probing for Nanoscale ICs through 10 µm Bulk Silicon. Proceedings of the 35th Annual NANO Testing Symposium (NANOTS2015), 215-221.


P. Scholz and M. Sadowski and S. Kupijai and M. Henniges and C. Theiss and S. Meister and D. Stolarek and H. Richter and M. Boostandoost and C. Boit (2015). Turning sample into (re)solution: Focused Ion Beam shaped Solid Immersion Lenses. Proceedings of the 41st International Symposium for Testing and Failure Analysis (ISTFA 2015). ASM International, 66-70.


W. Witte and D. Abou-Ras and K. Albe and G. Bauer and F. Bertram and C. Boit and R. Brüggemann and J. Christen and J. Dietrich and A. Eicke and D. Hariskos and M. Maiberg and R. Mainz and M. Meessen and M. Müller and O. Neumann and T. Orgis and S. Paetel and J. Pohl and H. Rodriguez-Alvarez and R. Scheer and H.-W. Schock and T. Unold and A. Weber and M. Powalla (2014). Gallium gradients in Cu(In,Ga)Se2 thin-film solar cells. Progress in Photovoltaics: Research and Applications


F. Friedrich and N. Herfurth and A. Teodoreanu and T. Sontheimer and V. Preidel and B. Rech and C. Boit (2014). Micro-contacting of single and periodically arrayed columnar silicon structures by focused ion beam techniques. Applied Physics Letters


R. Di Giacomo and R. Adami and V. Speranza and C. Barone and S. Pagano and P. Sabatino and G. Carapella and H. Wegner and C. Boit and A. De Girolamo Del Mauro and H. Neitzert (2014). Investigation of multiwalled carbon nanotube interconnection geometry and electrical characteristics of an CNT-filled aluminum microgap. Canadian Journal of Physics, 827-831.


J. Dietrich and D. Abou-Ras and S. Schmidt and T. Rissom and T. Unold and O. Cojocaru-Miredin and T. Niemann and M. Lehmann and C. Koch and C. Boit (2014). Origins of electrostatic potential wells at dislocations in polycrystalline Cu(In,Ga)Se2 thin films. Journal of Applied Physics, 103507.


A. Glowacki and C. Boit and P. Perdu and Y. Iwaki (2014). Backside spectroscopic photon emission microscopy using intensified silicon CCD. Microelectronics Reliability, 2105-2108.


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Technische Universität Berlin
Department of Semiconductor Devices
sec. E4
Einsteinufer 19
10587 Berlin